• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The present invention relates to a method (100) for inspecting and measuring a face of an object comprising at least two surfaces offset in depth with respect to each other, said surfaces forming in particular a step or a trench on / in said face, said method (100) comprising the following steps: - measurement (102) of an interferometric signal, said measured signal, at several points, said measurement, said inspected face; for at least one measurement point, extraction (108) of the signal measured relative to at least one, in particular to each surface, said extraction (108) providing for said measurement point an interferometric signal, said to be individual, for said surface ; - profilometric analysis (110) of the individual signals, independently for each surface. It also relates to a system for inspecting and measuring a face of an object implementing such a method.
    公开号:FR3050023A1
    申请号:FR1653158
    申请日:2016-04-11
    公开日:2017-10-13
    发明作者:Jean-Francois Boulanger；Benoit Thouy
    申请人:Fogale Nanotech SA；
    IPC主号:
    专利说明:

    "Method and system for inspecting and measuring optics of a face of an object"
    Technical area
    The present invention relates to a method for inspecting and optically measuring a face of an object, in particular for imaging patterns present on said face. It also relates to a system for inspecting a face of an object implementing such a method.
    The field of the invention is more particularly, but in a nonlimiting manner, that of optical profilometry.
    State of the art
    Optical profilometry makes it possible to inspect a face of an object with a view in particular to detecting and imaging patterns, such as, for example, steps or trenches present on said face.
    It is based on the measurement, then the study, of an interferometric signal obtained between a reference optical radiation and an optical inspection radiation from the same source, sent to the inspected face and reflected by said face. By relatively varying the optical path of the reference or inspection radiations, it is possible to determine from the interference fringe analysis the difference in length of the optical path traveled by the reflected optical inspection radiation relative to that of the optical path of the reference radiation, and deduce the depth or height of the inspected face at each measurement point for detecting and imaging the patterns present on said face.
    However, current optical profilometry techniques are limited in lateral resolution by the resolution of the optical imaging system that can image the surface of the object and the interference fringes. In particular, they do not make it possible to inspect or measure narrow patterns of characteristic dimensions close to the resolution limit of the optical system, even with a lens with a high magnification factor such as a 50x objective. In this case, the interferomethic signal obtained can not be exploited properly because the information relating to two adjacent surfaces of different depths, such as for example the two surfaces of a trench or a step, are systematically mixed with each other.
    An object of the present invention is to provide a method and a system for inspecting and measuring a face of a more accurate object.
    Another object of the present invention is to provide a method and system for inspecting and measuring a face of an object for accurately detecting and imaging narrow patterns without the use of expensive optical means.
    Another object of the present invention is to provide a method and a system for inspecting and measuring a face of an object for accurately detecting and imaging narrow patterns whose characteristic dimensions are of the order or less than the resolution limit of the imaging optical system.
    It is also an object of the present invention to provide a method and system for inspecting and measuring a face of an object for imaging narrow patterns with current inspection apparatuses with very little or no , modification of their hardware architecture.
    Statement of Invention
    At least one of these objectives is achieved with a method of inspecting and measuring a face of an object comprising at least two surfaces offset in depth relative to one another, said surfaces forming in particular a step or a trench on or in said face, said method comprising the following steps: measurement of an interferomethic signal, said measured signal, at several points, referred to as measuring points, of said inspected face; for at least one, in particular each measuring point, extraction of the measured signal relative to at least one, in particular to each surface, said extraction providing for said measurement point an interferomethic signal, said to be individual, for said surface, in particular for each surface; - profilometric analysis of the individual signals, independently for each surface.
    Such an extraction step, proposed by the method according to the invention is particularly advantageous when the measurement point is at an interface between two adjacent surfaces of different depths. Indeed, in this case, the interferometric signal measured comprises, in a mixed manner, information relating to each of the adjacent surfaces.
    The method according to the invention thus proposes to isolate, individually, the information relating to each surface component of the inspected face, by selecting in the measured interferometric signal, the portion of said measured signal corresponding to each surface, before the step profilometric analysis. Once isolated, each individual interferometric signal can be analyzed according to a known profilometry technique.
    Thus, the method according to the invention makes it possible to reduce or even cancel the information mixtures relating to two adjacent surfaces of different depths, in particular at the interface of these two surfaces, which makes it possible to carry out a more precise inspection. of a face of an object.
    Moreover, by reducing the information mixtures relating to two adjacent surfaces of different depths, in particular at the interface of these two surfaces, the method according to the invention makes it possible, with an optical imaging system and a sensor given, to imitate patterns of smaller dimensions, and in particular narrower, compared to the processes of the state of the art.
    In addition, the extraction step can be performed by digital or analog processing, and does not impact, or little, signal measurement steps. Consequently, the method according to the invention can be implemented by current inspection or measuring devices without, or with very little architectural modification, in particular of the optical part of these devices.
    In other words, the method according to the invention makes it possible to push back the limit of lateral resolution imposed by the optical imaging system and the sensor, by allowing the inspection and the dimensional measurement of patterns of dimensions characteristic of the order or less than this resolution limit, which could not be inspected or measured by this optical system otherwise. The extraction step can be implemented for all measuring points.
    Alternatively, the extraction step can only be implemented for the measurement points, located at an interface between two adjacent surfaces of different depths.
    Advantageously, the step of measuring the interferometric signal can perform a measurement of an interferometric signal for each pixel of a sensor performing a full-field measurement.
    In this case, each pixel may correspond to a measurement point for which an interferometric signal is measured.
    Advantageously, the method according to the invention may further comprise a step of constructing, independently, each surface as a function of the profilometric analysis of the individual signals of said surface.
    Indeed, by exploiting the depth detected in each individual interferometric signal for each measurement point, it is possible to group the individual signals relating to this surface and to build this surface independently.
    For this purpose, each measuring point is positioned at the depth detected for said measurement point in the individual interferometric signal relating to said measuring point.
    Furthermore, the method according to the invention may further comprise a step of constructing a representation of the inspected face, and in particular a three-dimensional representation of said face, comprising the patterns lying on said inspected face.
    Such a construction, in particular three-dimensional, can be achieved by concatenation of the depth values measured in each individual signal at each measurement point, and this for all surfaces.
    In other words, such a construction can be achieved by concatenation of the measurement points, at the depths detected in the individual interferometric signals for all the surfaces.
    In a particularly advantageous version, the step of constructing a representation of the inspected face can be performed from the individual representations of the surfaces.
    In this case, the construction step may include, for at least one measurement point, an iteration of the following steps: determining a signal quality value, at said measurement point, in at least two individual representations, and assigning said measuring point to one of the surfaces, as a function of the signal quality values obtained for each of said two individual representations.
    In particular, these steps can be performed for at least one, in particular each, measurement point assigned to two adjacent surfaces of different depths. In this case, the individual representations considered are those of said adjacent surfaces.
    Thus, the method according to the invention makes it possible to determine with greater precision, a three-dimensional representation of the inspected face.
    Indeed, it may happen that a measuring point which is at the interface between two adjacent surfaces of different depths is assigned to each of these two surfaces. In this case, a standard three-dimensional representation will show said measuring point in each of these adjacent surfaces. Which would be wrong. The method according to the invention makes it possible to avoid such double assignment, by discriminating based on the quality of the signal obtained for each of the adjacent surfaces, and to assign the measuring point to only one of the adjacent surfaces.
    In a nonlimiting embodiment, the allocation step may be performed by a predetermined comparison relation taking into account: the signal quality values of each individual representation, and a multiplier coefficient applied to a quality value. of signai of an individual representation.
    Thus, the method according to the invention makes it possible to allocate a measuring point to a surface when, for this measuring point, the quality of the signal in the individual representation of one of the surfaces is greater, possibly with a multiplier coefficient. the value of the signal quality in the individual representation of the other surfaces.
    According to an example of nonimimitation, the multiplier coefficient can be determined empirically or experimentally.
    According to another example of a nonlimiting embodiment, the multiplier coefficient can be determined by learning, for example from reference measurements on objects of known characteristics.
    Alternatively or in addition, the multiplier coefficient may be a function of at least one parameter of a measurement sensor used during the measuring step. Such a parameter of the measurement sensor may for example be a sensitivity of the sensor or a measurement uncertainty value of said sensor, for example given by the manufacturer or measured during prior tests.
    Alternatively or in addition, the multiplying coefficient can be determined according to at least one parameter of the inspected face. Such a parameter of the inspected face may for example be a reflection / refraction value of the material used, a theoretical difference in depth value between two adjacent surfaces, a characteristic dimension of the pattern, etc.
    In a particularly preferred embodiment, for at least one surface, the profilometric analysis step may comprise for each individual signal: a Fourier transform of said individual signal; and an analysis of the phase of the Fourier transform obtained.
    Indeed, the phase of the Fourier transform of the single interferometric signal of a single surface is linear, and the analysis of this phase makes it possible to accurately deduce a topographic information. On the other hand, it should be noted that this simple method does not work with an interferometric signal which comprises a mixture of information relating to two or more adjacent surfaces, because in this case the phase of the Fourier transform of the measured interferometric signal does not present not such linearity.
    In one version of the method according to the invention, for at least one surface, the step of extracting a signal measured relative to said surface may comprise a selection of a portion of said measured interferometric signal comprising an envelope corresponding to said surface. in said measured interferometric signal. This envelope may correspond to a local amplitude of fringes or significant interference signals.
    Such an extraction step is not very complex to implement, requires few resources and a very short processing time.
    In particular, for two adjacent surfaces of different depths, the selection step may advantageously perform a cutting of the interferometric signal measured in two portions each comprising an envelope corresponding to one of said surfaces in said measured signal, the individual signal for each surface corresponding to one of said portions.
    Of course, when for a measuring point, there are more than two adjacent surfaces of different depths, the cutting can be performed by considering the adjacent envelopes in the signal measured in pairs.
    Such a division is not very complex to implement, requires very few resources and a very short processing time of the measured interferometric signal.
    According to a particularly preferred embodiment, the cutting of the measured signal, for two adjacent envelopes, can be performed at a position of said measured signal: - located between said two adjacent envelopes, and - substantially equidistant from the positions of said adjacent envelopes.
    The positions of the envelopes may for example correspond to their respective vertices.
    For example, if the envelopes corresponding to two adjacent surfaces are separated, in the measured interferometric signal, by a distance of depth Δ, then the measured interferometric signal is split in two at a position between the two envelopes at a distance of distance Δ / 2 of the position of each envelope.
    In one version, the depth of each surface, and therefore the position of each envelope in the interferometric signal measured, can be previously indicated, in particular in an approximate or theoretical manner, prior to the inspection, for example by a designer or a manufacturer. of the object whose face is inspected.
    The depth of at least one surface of the inspected face may be indicated relative to another surface of said face.
    Alternatively or in addition, the method according to the invention may comprise a step of estimating the position, in the measured interferometric signal, of at least one envelope corresponding to a surface, prior to the extraction step.
    Such a step of estimating the position of an envelope can be performed in different ways, by analyzing the interferometric signal measured.
    In particular, the step of estimating the position of an envelope in the measured interferometric signal may comprise a step of: demodulation of the measured interferometric signal, and / or analysis of the energy of the measured interferometric signal, and or - contrast analysis of the fringes of the measured interferometric signal.
    For example, in the context of an energy analysis, the position of an envelope in the measured signal can be detected by detecting the position of a local maximum of the energy of the measured interferometric signal.
    In the context of a demodulation analysis, the position of an envelope in the measured signal can be detected by applying a low-pass filter to the rectified signal. This low pass filter makes it possible to eliminate the high frequency component of the rectified signal, ie the fringes, while keeping the low frequency component, that is to say the envelope of the signal. The rectified signal can be obtained for example with an absolute value operator, a thresholding at the average value, a squared elevation, or a multiplication by a carrier of the same frequency (synchronous demodulation).
    In the context of a fringe contrast analysis, the position of an envelope in the measured signal can be detected by searching for the amplitude and / or the peaks of the interference fringes, for example with comparison operators or by derivation.
    According to another aspect of the same invention, there is provided a system for inspecting and measuring a face of an object comprising at least two surfaces offset in depth relative to one another, said surfaces forming particularly a step or a trench on or in said face, said system comprising: - a device for measuring an interferometric signal, said measured signal, at several points, said measurement, said inspected face; and a measured interferometric signal processing module, configured to implement all the steps of the method according to the invention.
    The configuration of the processing module can be carried out electronically and / or informally, in particular with instructions executable by a processor or an electronic chip, of the EEPROM type for example.
    The processing module may be integrated with the measuring device, or external to the measuring device and connected to said measuring device in a wired or wireless manner.
    In an advantageous version, the measuring device may comprise a full-field interferometric sensor.
    In this case, a measuring point may correspond to a pixel of said sensor.
    The method and system according to the invention can each be used for the inspection of a face of a semiconductor element or a wafer, in particular for the measurement of the depth (s) of sliced (s) and / or height (s) of walking (s) present (s) on said face, or to image said face.
    More generally, the method and system according to the invention can each be used for inspecting a face of an object, in particular for the detection and / or characterization and / or imaging of at least one object. pattern of said face.
    DESCRIPTION OF THE FIGURES AND EMBODIMENTS Other advantages and characteristics will appear on examining the detailed description of non-limitative examples, and the appended drawings in which: FIG. 1 is a schematic representation of an exemplary embodiment non-limiting of a method according to the invention; FIGS. 2a-2h are diagrammatic representations of an example of non-limiting inspection and measurement of a face of an object such as a wafer with the present invention, and in particular with the method of FIG. 1 ; and FIG. 3 is a schematic representation of a nonlimiting exemplary embodiment of a system according to the invention.
    It is understood that the embodiments which will be described in the following are in no way limiting. It will be possible, in particular, to imagine variants of the invention comprising only a selection of characteristics described subsequently isolated from the other characteristics described, if this selection of characteristics is sufficient to confer a technical advantage or to differentiate the invention with respect to the state of the art. This selection comprises at least one feature preferably functional without structural detail, or with only a part of the structural details if this part alone is sufficient to confer a technical advantage or to differentiate the invention from the state of the prior art.
    In particular, all the variants and all the embodiments described are combinable with each other if nothing stands in the way of this combination at the technical level.
    In the figures, the elements common to several figures retain the same reference.
    FIGURE 1 is a schematic representation of a non-limiting embodiment of a method according to the invention.
    The method 100, shown in FIG. 1, comprises a step 102 for measuring an interferometric signal at several measurement points on one face of an object, for example using a full-field interferometric sensor. In this case, each pixel of the sensor corresponds to a measurement point, and an interferometric signal is measured by each pixel of said sensor.
    The method 100 further comprises a processing phase 104, performed for each measurement point, that is to say for each measured interferometric signal.
    The processing phase 104 comprises a step 106 realizing an estimation of the position of each envelope in the measured interferometric signal. This estimation step 106 is performed by demodulating the interferometric signal measured by applying a low-pass filter on the rectified signal after subtraction of the background (or by performing a synchronous demodulation). The background is calculated by smoothing the signal with a sufficiently wide sliding averaging window. The low pass filter makes it possible to eliminate the high frequency components of the rectified signal while maintaining the low frequency component, that is to say the envelope. The local maxima of the demodulated signal that exceed a predetermined amplitude threshold are detected and their position memorized. The amplitude threshold can be chosen, for example, to find a good compromise between a number of false detections and a number of non-detection of envelopes, the challenge being to detect weak signals without the noise in the interferometric signals. does not involve too many false detections. This detection threshold may be fixed or adaptive as a function, for example: of a criterion related to the amplitude of the demodulated signal (peak value, rms value) over the entire signal or in a neighborhood; and / or - a criterion related to a measurement of the noise of the interferometric signal measured.
    The interferometric signal is then processed, during a step 108, considering that each envelope detected during step 106 corresponds to a different depth surface. In particular, the processing consists in cutting the interferometric signal in as many portions as there are envelopes in said measured interferometric signal. Cutting of the interferometric signal is performed between the adjacent envelopes, taken in pairs, at a position substantially equidistant from the position of each of said two adjacent envelopes. For example, when the interferometric signal comprises N envelopes Ek, with l <k <N and Dk the position of the envelope k in said measured interferometric signal, a first portion Pi comprising the envelope Ei is first cut into a position cutting edge DDi located between the positions Di and D2, and equidistant positions Di and D2. Then, a second portion P2 comprising the envelope E2 is cut off: this second portion corresponds to the portion of the interferometric signal measured between the first cutting position DDi and a second cutting position DD2 located between the positions D2 and D3, equidistant from positions D2 and D3, and so on. The last portion Pn corresponds to the portion of the interferometric signal measured between the penultimate cutting position DDn-i and the end of the measured interferometric signal.
    When the measured interferometric signal comprises only two envelopes E 1 and E 2, then it is divided into two portions at a cutting position DD 1 lying between the positions D 1 and D 2 and equidistant from the positions D 1 and D 2. The first portion Pi comprises the beginning of the signal measured up to the cutting position DDi and the second portion P2 comprises the end of the signal measured from the cutting position DDi.
    Each portion obtained during the cutting step forms an individual signal for each surface of the inspected face.
    In a step 110, a profilometric analysis of each individual signal is performed to detect the position of the surface to which corresponds the single envelope contained in the individual signal. During this step 110 each individual signal undergoes: a Fourier transform of said individual signal; and an analysis of the phase of the Fourier transform obtained.
    The frequency domain where the phase of the Fourier transform is linear corresponds to the frequency domain of the light source of the profilometer.
    In addition, the depth of the surface at the corresponding measurement point can be deduced from the slope of the phase in this frequency range or from the value of the phase at the center frequency of the profilometer light source.
    The processing phase 104 ends in step 110.
    In a step 112, depending on the profilometric analysis of the individual signals, an individual construction of each surface of a given depth is performed by concatenation of the measurement points detected at said depth.
    When building surfaces individually, it is possible and frequent, especially when using a high-magnification objective, such as a 50x, that at the same measurement point, two different depths are detected , and therefore this measuring point is assigned to two surfaces of different depths. Such a situation occurs especially when the measuring point is at the boundary between two adjacent surfaces of different depths.
    During a phase 114, a three-dimensional representation of the inspected face is performed.
    During this phase 114, a step 116 performs a concatenation / merger of the individual representations obtained during the step 112, for all the measurement points.
    When a litigious measurement point, noted (i, j), is detected as belonging to two different surfaces, a step 118 determines the quality Qi (i, j) and Q2 (i, j) of the individual measurement signal corresponding to the surface 1, respectively at the surface 2. This quality measurement is obtained from the maxima recorded on the demodulated signal during the interface / envelope detection step (step 106). It corresponds for example to the maximum amplitude of the envelope of the surface considered.
    A step 120 performs an assignment of said contentious measurement point to one of the two surfaces by comparing the qualities Qi (i, j) and QzCiJ. For example: if Qi (i, j) <3 -Q2 (i , j), then the measuring point (i, j) is assigned to surface 2; and if Qi (i, j)> 3-Q2 (i, j), then the measuring point (i, j) is assigned to surface 1.
    A weighting factor, or multiplier β, is applied to the quality measures to perform the comparison. In the embodiment implemented, this multiplier coefficient β is determined experimentally so as to substantially compensate for the difference in light energy reflected by the different surfaces of the patterns. Indeed, the background of the patterns (surface 2 in the examples shown) generally reflects less light naturally than the upper surfaces (surface 1). We thus choose a multiplier coefficient β> 1, such as for example β = 5.
    In a step 122, a graphical representation of the inspected face is performed.
    The method 100 may further include study and statistical steps regarding widths, heights, pattern depths, such as steps or trenches.
    FIGURES 2a-2g give schematic representations of an example of a face inspected in accordance with the method according to the invention, such as for example the method 100 of FIGURE 1.
    In particular, the face 200, shown in FIG. 2a, is a face of a semiconductor comprising steps 202 and trenches 204.
    FIGURE 2b is an example of a measured interference signal, for example at step 102 of method 100 of FIGURE 1, at a point 206 at the interface between a step 202 and a trench 204. L The x-axis is the depth, and the y-axis is the intensity value scale of the camera (the grayscale of the camera). The measured interference signal 208, shown in FIG. 2b, comprises two envelopes: the envelope 210i corresponds to a step 202 and the envelope 21O2 corresponds to a trench 204.
    FIG. 2c is an example of two individual signals obtained, for example at the step 108 of the method 100 of FIG. 1, after cutting off the signal 208 at a cutting position 212, located between the envelopes 210i and 21O2, and equidistant positions of said envelopes 21O1 and 21O2. The individual signals 214i and 2142 respectively comprise the envelope 210i and the envelope 21O2.
    FIG. 2d is an example of two signals 216i and 2I62 representing the phase of the Fourier transform, respectively of the individual signals 214i and 2142 of FIG. 2c, obtained for example at the step 110 of the method 100 of FIG. note that each signal 2161 and 2162 has an area, respectively 218i and 2182, where the phase is substantially linear. Each linear zone 218i and 2I82 makes it possible to calculate the depth of the corresponding surface, namely, respectively of the step 202 or the trench 204, for the measuring point 206.
    FIG. 2d also gives an example of a signal 2I63 representing the phase of the Fourier transform of the measured interference signal 208. It can be seen that in this case the phase does not comprise a linear zone making it easy to deduce information from it. depth.
    FIGURE 2e is an example of an individual representation of each of the surfaces, namely a representation 218i of the surface formed by the steps 202 and a representation 2182 of the surface formed by the trenches 204 and by the surface outside the pattern, obtained for example in step 112 of method 100 of FIGURE 1. As seen in FIGURE 2e, in FIGURES 2I81-2I82, certain measurement points have been assigned both to the surface formed by the steps 202 and that formed by the trenches 204. In particular, the measurement points for the trenches 204 located between the steps 202, have been assigned to each surface, since the representation 218i shows a continuous surface between the steps. 202.
    FIGURE 2f is an example of a flat representation, and FIGURE 2g is a three-dimensional representation of the inspected face 200, obtained for example in step 122 of method 100 of FIGURE 1, after managing the points at issue in step 120.
    It can be seen in particular that a representation of the pattern in the plane is obtained with a location of the transitions that is better than in the original image of FIG. 2a, and thus improved with respect to the resolution limit due to the imaging system. The three-dimensional representation of FIGURE 2g illustrates the accuracy of the depth measurements obtained at each measurement point.
    FIGURE 2h gives a statistical study in the form of a histogram covering all the measurement points, and the depth of these measurement points. It makes it possible in particular to see the depth distribution: from the lower surface to the outside of the pattern corresponding to the peak 220i; from the lower surface to the interior of the trenches corresponding to the peak 22O2; the upper surface corresponding to the peak 22O3.
    FIGURE 3 is a schematic representation of a non-limiting embodiment of a system according to the invention.
    The system 300, shown in FIG. 3, comprises a light source 302, for example based on light-emitting diodes or a halogen source, which generates an illumination beam 304 in visible and / or near-infrared wavelengths. This illumination beam 304 is directed to a full-field interferometer 306 by a cube or splitter plate 308.
    In the full-field interferometer 306, the illumination beam 304 is separated into a reference beam which illuminates a reference mirror and a measurement beam which illuminates an area to be inspected, for example the surface 200 of FIGURE 2a. The light reflected respectively by the surface 200 and the reference mirror is redirected to a matrix detector 310, for example of the CCD or CMOS type.
    The system 300 includes optics and lenses, including an imaging lens, arranged to image the surface 200 on the matrix detector 310. When the difference in optical paths between the measurement beam and the reference beam is less than the coherence length of the light source 302, interference fringes due to interference between the measurement beam and the reference beam are also visible.
    There are different kinds of full field interferometers 306 usable in the context of the invention, which are well known to those skilled in the art and will not be detailed here.
    The system 300 further comprises a module 312 electronic / computer, such as a processor or an electronic chip or a personal computer for example, connected to the matrix detector 310, and configured to implement all the steps of the method according to the invention, such as, for example, steps 104-122 of method 100 of FIGURE 1.
    Of course, the invention is not limited to the examples that have just been described and many adjustments can be made to these examples without departing from the scope of the invention.
    权利要求:
    Claims (15)
    [1" id="c-fr-0001]
    A method (100) of inspecting and measuring a face (200) of an object comprising at least two surfaces (202, 204) offset in depth relative to one another, said surfaces forming in particular a step (202) or a trench (204) on or in said face (200), said method (100) comprising the steps of: - measuring (102) an interferometric signal (208), said measured signal, at several points (206), said measurement, of said face (200) inspected; for at least one measuring point (206), extracting (108) the signal measured relative to at least one, in particular to each surface, said extraction (108) providing for said measurement point an interferometric signal (214), said individual, for said surface; - profilometric analysis (110) of the individual signals (214), independently for each surface.
    [2" id="c-fr-0002]
    2. Method (100) according to the preceding claim, characterized in that the measuring step (102) performs a measurement of an interferometric signal for each pixel of a sensor (310) performing a full-field measurement, each corresponding pixel. at a measuring point (206).
    [3" id="c-fr-0003]
    3. Method (100) according to any one of the preceding claims, characterized in that it further comprises a step (112) of constructing, independently, each surface according to the profilometric analysis of the individual signals ( 214) of said surface.
    [4" id="c-fr-0004]
    4. Method (100) according to any one of the preceding claims, characterized in that it further comprises a step (114) for constructing a representation of the inspected face (200).
    [5" id="c-fr-0005]
    5. Method (100) according to claims 3 and 4, characterized in that the step (114) of construction of a representation of the inspected face (200) is performed from the individual representations of the surfaces, said step (114) ) comprising, for at least one measurement point (206), an iteration of the following steps: - determining (118) a signal quality value, at said measurement point (206), in at least two individual representations, and assigning (120) said measurement point (206) to one of said surfaces, as a function of the signal quality values obtained for each of said two individual representations.
    [6" id="c-fr-0006]
    6. Method (100) according to the preceding claim, characterized in that the allocation step (120) is performed by a predetermined comparison relation taking into account: the signal quality values of each individual representation, and a multiplier coefficient applied to a signal quality value of an individual representation.
    [7" id="c-fr-0007]
    7. Method (100) according to any one of the preceding claims, characterized in that, for at least one surface, the profilometric analysis step (110) comprises, for each individual signal (214): Fourier of said individual signal; an analysis of the phase (216) of the Fourier transform obtained.
    [8" id="c-fr-0008]
    8. Method (100) according to any one of the preceding claims, characterized in that, for at least one surface, the step of extracting (108) a measured signal (208) relative to said surface comprises a selection a portion of said measured signal (108) comprising an envelope (210) corresponding to said surface in said measured signal (208).
    [9" id="c-fr-0009]
    9. Method (100) according to the preceding claim, characterized in that, for two adjacent surfaces of different depths, the selection step performs a cutting (108) of the measured signal (208) in two portions each comprising an envelope (210). ) corresponding to one of said surfaces in said measured signal (208), the individual signal (214) for each surface corresponding to one of said portions.
    [10" id="c-fr-0010]
    10. Method (100) according to the preceding claim, characterized in that the cutting (108) of the measured signal (208), for two adjacent envelopes (210), is made at a position (212) in said measured signal (208) : - located between said two adjacent envelopes (210), and - substantially equidistant from the positions of said adjacent envelopes (210).
    [11" id="c-fr-0011]
    11. Method (100) according to any one of claims 8 to 10, characterized in that it comprises a step (106) for estimating the position, in the measured signal (208), of at least one envelope (210) corresponding to a surface, prior to the extraction step (108).
    [12" id="c-fr-0012]
    12. Method (100) according to the preceding claim, characterized in that the step (106) for estimating the position of an envelope (210) in the measured signal (208) comprises a step of: - demodulation of the signal measured (208), - analysis of the energy of the measured signal (208), and / or - contrast analysis of the fringes of the measured signal (208).
    [13" id="c-fr-0013]
    13. System (300) for inspecting and measuring a face (200) of an object comprising at least two surfaces offset in depth relative to each other, said surfaces forming in particular a step (202). ) or a trench (204) on or in said face (206), said system (300) comprising: - a device (310) for measuring an interferometric signal (208), said measured signal, at several points (206) , said measure, said inspected face (200); and a measured interferometric signal processing module (312) (208) configured to implement all the steps of the method (100) according to any one of the preceding claims.
    [14" id="c-fr-0014]
    14. System (300) according to the preceding claim, characterized in that the measuring device comprises a full-field interferometric sensor (310).
    [15" id="c-fr-0015]
    15. Use: - of the method (100) according to any one of claims 1 to 12, or - of the system (300) according to any one of claims 13 or 14; for inspecting a face (200) of a semiconductor or a wafer, in particular for the measurement of trench depth (s) (204) and / or height (s) of step (s) (202) present in / on said face (200).
    类似技术:
    公开号 | 公开日 | 专利标题
    WO2017178306A1|2017-10-19|Method and system for inspecting and measuring optically a face of an object
    US9587932B2|2017-03-07|System for directly measuring the depth of a high aspect ratio etched feature on a wafer
    KR100981401B1|2010-09-10|Small displacement measuring method and instrument
    KR101815325B1|2018-01-04|System for directly measuring the depth of a high aspect ratio etched feature on a wafer
    FR2959305A1|2011-10-28|OPTICAL DEVICE AND METHOD FOR INSPECTING STRUCTURED OBJECTS.
    FR3026481A1|2016-04-01|DEVICE AND METHOD FOR SURFACE PROFILOMETRY FOR CONTROLLING WAFERS DURING PROCESS
    WO2004109229A2|2004-12-16|3d and 2d measurement system and method with increased sensitivity and dynamic range
    WO2017108400A1|2017-06-29|Device and method for measuring height in the presence of thin layers
    CN107894204B|2020-02-21|Interferometer and imaging method thereof
    JP5581282B2|2014-08-27|Surface shape measuring device
    JPWO2013118543A1|2015-05-11|Surface measuring device
    KR102091320B1|2020-03-19|Terahertz wave based defect measurement apparatus and measuring method using the same
    FR3026484A1|2016-04-01|METHOD AND SYSTEM FOR INSPECTING TRANSPARENT PLATES FOR ELECTRONICS, OPTICS OR OPTOELECTRONICS
    EP3236241A1|2017-10-25|Method and device for measuring the optical characteristics of a sample
    US10598604B1|2020-03-24|Normal incidence phase-shifted deflectometry sensor, system, and method for inspecting a surface of a specimen
    EP3080592A1|2016-10-19|Method and device for analyzing the surface of a substrate
    WO2010034955A1|2010-04-01|Reflection microscope focusing
    EP3735578A1|2020-11-11|Method and system for optically inspecting a substrate
    WO2021160861A1|2021-08-19|Method and device for mapping the thickness of an object
    WO2018219785A1|2018-12-06|Method and system for reconstituting colour information of a sample measured by white light optical profilometry, and applications of said method
    EP3749919A1|2020-12-16|Method and device for inspecting a surface of an object comprising non-similar materials
    WO2020109486A9|2021-03-25|Method and system for measuring a surface of an object comprising different structures using low-coherence interferometry
    Pawlowski et al.2005|Multispectral phase-crossing white-light interferometry
    Katic et al.2010|Edge detection uncertainty in fringe analysis
    FR3000265A1|2014-06-27|METHOD FOR EVALUATING THE METROLOGICAL PERFORMANCE OF A CINEMATIC FIELD MEASUREMENT BY CORRELATION OF DIGITAL IMAGES
    同族专利:
    公开号 | 公开日
    EP3443295A1|2019-02-20|
    CN109073355A|2018-12-21|
    WO2017178306A1|2017-10-19|
    KR20180127412A|2018-11-28|
    US20190137265A1|2019-05-09|
    FR3050023B1|2020-02-14|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    US5471303A|1994-04-29|1995-11-28|Wyko Corporation|Combination of white-light scanning and phase-shifting interferometry for surface profile measurements|
    JP2000097648A|1998-09-25|2000-04-07|Toshiba Corp|Device and method for measuring difference in level|
    JP2003065724A|2001-08-29|2003-03-05|Shin Etsu Handotai Co Ltd|Method for measuring thickness of film using ftir method, and method for manufacturing semiconductor wafer|
    CN100587394C|2007-09-20|2010-02-03|华中科技大学|Method and device for measuring micro-nano deep groove structure|
    US8120781B2|2008-11-26|2012-02-21|Zygo Corporation|Interferometric systems and methods featuring spectral analysis of unevenly sampled data|CN110160450B|2019-05-13|2020-12-25|天津大学|Method for rapidly measuring height of large step based on white light interference spectrum|
    CN111356896B|2020-02-24|2021-01-12|长江存储科技有限责任公司|System and method for semiconductor chip surface topography metrology|
    CN111386441B|2020-02-24|2021-02-19|长江存储科技有限责任公司|System for measuring surface topography of semiconductor chip|
    WO2021168611A1|2020-02-24|2021-09-02|Yangtze Memory Technologies Co., Ltd.|Systems and methods for semiconductor chip surface topography metrology|
    法律状态:
    2017-04-25| PLFP| Fee payment|Year of fee payment: 2 |
    2017-10-13| PLSC| Search report ready|Effective date: 20171013 |
    2018-04-20| TP| Transmission of property|Owner name: UNITY SEMICONDUCTOR, FR Effective date: 20180316 |
    2018-04-26| PLFP| Fee payment|Year of fee payment: 3 |
    2019-04-29| PLFP| Fee payment|Year of fee payment: 4 |
    2020-04-28| PLFP| Fee payment|Year of fee payment: 5 |
    2021-04-27| PLFP| Fee payment|Year of fee payment: 6 |
    优先权:
    申请号 | 申请日 | 专利标题
    FR1653158|2016-04-11|
    FR1653158A|FR3050023B1|2016-04-11|2016-04-11|METHOD AND SYSTEM FOR OPTICAL INSPECTION AND MEASUREMENT OF A FACE OF AN OBJECT|FR1653158A| FR3050023B1|2016-04-11|2016-04-11|METHOD AND SYSTEM FOR OPTICAL INSPECTION AND MEASUREMENT OF A FACE OF AN OBJECT|
    CN201780022856.0A| CN109073355A|2016-04-11|2017-04-05|Method and system for optical check and measurement body surface|
    KR1020187029944A| KR20180127412A|2016-04-11|2017-04-05|Method and system for optically measuring and inspecting a surface of an object|
    EP17719184.8A| EP3443295A1|2016-04-11|2017-04-05|Method and system for inspecting and measuring optically a face of an object|
    US16/092,751| US20190137265A1|2016-04-11|2017-04-05|Method and system for the optical inspection and measurement of a face of an object|
    PCT/EP2017/058145| WO2017178306A1|2016-04-11|2017-04-05|Method and system for inspecting and measuring optically a face of an object|
    [返回顶部]